HyperX 16GB is DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
– Power Supply: VDD = 1.2V Typical
– VDDQ = 1.2V Typical
– VPP = 2.5V Typical
– VDDSPD = 2.2V to 3.6V
– On-Die termination (ODT)
– 16 internal banks; 4 groups of 4 banks each
– Bi-Directional Differential Data Strobe
– 8 bit pre-fetch
– Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
– Height 1.624″ (41.24mm), w/heatsink
Specifications
Latency
Default (JEDEC) CL17-17-17 @1.2V
XMP Profile #1: CL16-18-18 @1.35V
XMP Profile #2: CL15-17-17 @1.35V
Row Cycle Time (tRCmin)
45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
32ns(min.)
UL Rating
94 V – 0
Operating Temperature
0°C to +70°C
Storage Temperature
-40°C to +85°C
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